ASIC / RFIC / Chiplet Solutions

Products

Quantum Leap Solutions offers a comprehensive portfolio of ASIC, RFIC, and Chiplet solutions designed to meet diverse application requirements. Whether Off-the-Shelf or fully customized, our proven technologies enable seamless integration across multiple process platforms.


Best-in-Class ASIC, RFIC, and Chiplet Solutions

  • Tailored designs optimized for performance, power, and area
  • Silicon-proven architectures ensuring reliability and efficiency

Customizable Solutions for Your Application & Markets

  • Precision-engineered ASICs and RFICs to meet unique specifications
  • Chiplet-based architectures for scalable and modular system design

Specifications, Process Offerings, and Deliveries

  • Support for a wide range of process nodes and foundry partners
  • Streamlined development cycles for accelerated time to market

Flexible Engagement Models for ASIC, RFIC, and Chiplet Development

  • IP Licensing and design services
  • Full turnkey solutions specializing in wireless and mixed-signal ASICs
  • Standard product to ASIC conversion services for cost savings and IP protection
  • End-to-end manufacturing, including packaging, assembly, and test

View our Partners' offerings in our QLS Partner Portfolio

ASIC/ RFIC / Chiplet Partner Offerings

Ensilica Products

EnSilica, a UK company founded in 2001, is a fabless ASIC supplier that designs and supplies digital & mixed signal ASICs for automotive/industrial, healthcare and communications markets.

With a staff of 156 >10% PhDs, Ensilica has expertise in System, RF, Analog, Mixed-Signal, Digital, Software Design, Verification, Test, Package development, Production & Supply Chain.

Committed to quality, EnSilica is ISO9001:2015 certified, is an ARM Approved Design and Function Safety Partner, and an Arm Center of Excellence. Ensilica is a TSMC DCA and GF Partner, and an approved supplier to 3 major automotive Tier 1s and one industrial OEM. EnSilica is is also a VCA-lite partner.

EnSilica has offices in Oxford (HQ), Wokingham (UK), Sheffield (UK), Bangalore (India) and Porto Algere (Brazil).

EnSilica have ASIC and design expertise in the following application areas:

  • RF & Wireless:
    • RFIC design in CMOS, SiGe and BiCMOS
    • Low power GHz and sub-GHz radio design
    • Sub-1V operation
    • RFIC IP
    • Design of RF FE for LTE/5G, BT Classic/LE, WiFi, 802.15.6, NFC, DAB/FM, DVBS2X/RCS2
    • RF IP SoC integration
    • Custom radio designs
    • Safety & security critical proprietary radio
    • Optical communications
    • Rx/Tx
    • VCSEL/laser/LED drivers
    • Photodiode/APD receivers
  • Sensing & Control:
    • Sensor Integration
    • Multiple sensor integration
    • Motion, magnetic, gases, respiration, thermal, humidity bio functions etc.
    • High voltage / automotive
    • High/low-side (36V) current-sense amplifier, 5 uVrms 0-10 kHz noise, >90dB CMRR
    • Trimmed for gain and offset stability over PVT
    • Designed for redundancy and compliance with functional safety goals
    • Low-power / low-noise
    • Voltage amplifiers for bio-signals, noise 100 nV/√Hz 0-100Hz, >90dB CMRR, 5 uA supply current
    • Transimpedance amplifier for gyro sensor, 100 fA/√Hz noise, precise phase response
    • Transimpedance amplifier for bio-signals, 10 pA/ √Hz noise, 100 uA supply current
    • Complex impedance measurement front-end
  • Power Management:
    • Low-power SoC design
    • Multiple power modes
    • Energy scavenged
    • Low-power oscillators, PLLs
    • Power management
    • DC-DC, LDO
    • Voltage / Frequency scaling
    • With sub-1V operation, power gating
    • Custom logic and IO cell design including thick oxide libraries
  • Healthcare and Medical:
    • Low power sensor interface for wearable healthcare and medical :
    • 3 lead ECG support
    • 2 pulsed photocurrent measurement inputs and drivers for
    • PPG (Heart Rate)
    • SpO2
    • NIRS (near infra-red spectroscopy)
    • Fluorescent glucose sensing (non[1]invasive to body tissue)
    • Body temperature sensor
    • Differential capacitive sensor
    • MEMS sensor interfacing
    • Complete with reference board and software
  • Satellite RFICs
    • Ka band suitable for GEO, LEO
    • 17.2 to 21.2 GHz Rx
    • 27.5 to 30.0 GHz Tx
    • 4 Rx element paths
    • 4 Tx element paths
    • Ka-band fine gain and phase control
    • Integrated IQ frequency conversion
    • Comprehensive and flexible IQ IF/BB path to data converters
    • Low power operation VDDRF=1.1V
    • Logic at 1.8V
    • Support for large arrays
    • Analog, hybrid & digital beamforming
    • Small size WLCSP
  • Digital and DSP
    • Systems/DSP expertise include
    • Modem design – BLE/DVB/DAB/WiFi
    • Remote Radio Heads - DDC/DUC
    • Advanced MIMO processing and beamforming
    • Advanced Radar signal processing
    • Cryptography
    • Development of efficient data-path designs
    • Integration of high speed interfaces
    • PCIe, USB, MIPI, CSI-2, CPRI, 1/25/10Gb Ethernet, LPDDR/DDR
    • Processor integration
    • Cores - Arm, Cadence Tensilica, MIPS
    • AMBA - AHB/AXI/APB
    • Advanced Verification
    • Constrained random SV based verification using UVM and VIPs
    • Embedding system models in environment using MATLAB/SystemC
    • FPGA based prototyping / emulation
    • Bit accurate models and GPU acceleration in CUDA
    • Post silicon validation
    • Embedded software
    • DSP and embedded software development for Arm, TenSilica, GPUs
    • Linux drivers and BSP
    • Physical design
    • Experience with all main foundries TSMC, GF, and SMIC
    • All main nodes from 180nm to 6nm
    • DFT for mixed signal, RF and digital including memory and other BIST, Test Compression, Boundary scan, JTAG
    • Best in the class tools follow including Cadence, Synopsys, Mentor and Keysight
    • Low-power design: clock gating, switchable power domains, voltage and frequency scaling, near threshold



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QuickLogic: Your Partner in Programmable Logic Solutions

QuickLogic, a trusted partner of Quantum Leap Solutions, brings over 35 years of expertise in FPGA technology. Headquartered in San Jose, CA, and ISO-9001 certified, QuickLogic is a NASDAQ-listed company (QUIK) known for its innovative programmable logic solutions.

Key Offerings:

  • eFPGA IP: QuickLogic's embedded FPGA Intellectual Property (eFPGA IP) enhances integration, reduces latency, and lowers power consumption compared to traditional FPGAs. It supports a wide range of process nodes from 12nm to 250nm, making it suitable for various applications, including commercial, automotive, and radiation-hardened environments.
  • Design Services: QuickLogic offers comprehensive design services to help customers achieve efficient, reliable, and scalable reprogrammable logic architectures. Their open-source tools and flexible solutions ensure fast time-to-market and easy integration with standard ASIC tool flows.
  • Device Storefront: QuickLogic provides a storefront for FPGAs, chiplets, and more, catering to diverse customer needs.

Market Applications:

QuickLogic's solutions are widely adopted in various markets, including aerospace and defense, industrial automation, automotive, data centers, and wireless communication. Their eFPGA technology is particularly beneficial for applications requiring efficient calculation, precise timing, security, and size, weight, power, and cost reduction (SWAP-C).

Recognition:

QuickLogic has been honored with multiple awards, including BAE Systems' 'Partner 2 Win' Supplier of the Year award and the 'FAST LabsTM Technology Innovation Partner Of The Year' award, highlighting their dedication to delivering state-of-the-art embedded FPGA Hard IP capability to the Defense Industrial Base.

Innovative Solutions:

QuickLogic's FPGA-based solutions offer flexibility, adaptability, and built-in security features. Their technology enables continuous reprogramming to comply with updated security standards, making them a pivotal tool in the defense against cyberattacks.

Future Vision:

QuickLogic is committed to advancing programmable logic solutions with their chiplet vision, supporting new process nodes and enabling seamless integration with other chiplets based on application needs.






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